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HIGH-DENSITY COOLING: EXPERTS IN AI DATA CENTER THERMAL
DEPLOYMENT & LIQUID COOLING INTEGRATION

We provide end-to-end thermal management solutions for next-generation computing infrastructure. from chip to cooling tower.
120k+ heat rejection per rack, zero cooling downtime record., ensuring critical loads like NvIDIA H100/A100 always operate in their
optimal range. Served clients: Supercomputing centers, AI training clusters,Tier 3/4 data centers, enterprise selt-built server rooms

Core Value

Single-rack cooling capacity

2120kW (supports GPU cluster), featuring cold plate liquid cooling with auxiliary air cooling.

Cooling medium

Hybrid deployment of liquid cooling (cold plate/immersion) and air cooling, compatible with existing air cooling architecture, and gradually adding liquid cooling nodes

Material Standard

SUS304 stainless steel body, 100% quality inspection of X-ray welded seams, corrosion-resistant, zero leakage.

Compatible Voltage

Integrated high-to-low voltage access (480V/208V), no need to renovate the distribution room, saving 30% of distribution costs.

Environmental adaptability

Stable operation at a high temperature of 55°C; according to actual measurements in the summer in Texas, there is no condensation at a relative humidity of 95%.

We not only deliver equipment, but also deliver 'Cooling as a Service' – including heat load verification, adaptive control, and full lifecycle operation and maintenance.

Flexible deployment model

Seamless integration of liquid cooling/air cooling

Maintain the existing air-cooling architecture and gradually deploy liquid-cooling nodes in phases to avoid the risk of a full system overhaul.

Heat Load Verification

Using CFD thermal simulation and actual measurement calibration to identify hotspot blind spots in advance, ensuring no temperature exceeds limits after deployment.

Adaptive Control

Based on real-time load dynamic adjustment of cooling allocation, the PUE can be optimized to below 1.25.

Phased Deployment Strategy

First address non-critical areas, then the core areas, achieving zero-interruption deployment.

One-stop solution

TARGETED GPU COOLING

· Custom cold plate solutions for high-powerchips like NVIDIA H100/A100 (TDP 700W+),
reducing hotspot temperature by 18°C.

High voltage to low voltage access

Integrated transformers and distribution units can be directly connected to 480V/208V systems without the need for additional power distribution modifications.

Delivery cycle!

On average, it takes 8 weeks from assessment to deployment, with a dedicated project manager coordinating civil, electrical, and HVAC specialties.

Full-cycle operations and maintenance

24/7 cloud monitoring with on-site support from a North American local team, responding to issues within 4 hours.